Quantum-O · Roadmap
Staged engineering.Not vision language.
Quantum hardware is credible only when its milestones are named, ordered, and de-risked. This is the plan for Quantum-O — and what has to be true before each next phase begins.
Phase 01 · Near-term
Tooling, packaging, orchestration
- · Q-Ov1 open runtime — public API stability
- · Quantum SDK circuits & preset library
- · Hybrid benchmarking harness against classical baselines
- · Enterprise readiness scoring platform (v1)
De-risking
Software-first. Every deliverable in this phase is achievable on today's simulators and hosted nodes — no hardware dependency.
Phase 02 · Mid-term
Chipset v1.0 tape-out & centre pilots
- · Q-O v1.0 monolithic die — fabrication run
- · Cryo-CMOS control tier co-integration
- · First Quantum Centre pilot — SLA-backed access
- · Enterprise workload pilots on real silicon
De-risking
Executed with a foundry partner on a CMOS-compatible flow. Yield risk is contained to a fixed number of tape-out cycles funded per phase.
Phase 03 · Long-term
Consumer-device packaging & v2.0
- · Micro-cryogenic package prototype
- · Host-device reference carrier
- · Q-O v2.0 architecture — expanded qubit plane
- · Regional Quantum Centre network expansion
De-risking
The consumer form factor is speculative until the thermal budget is met in hardware. This phase is gated on measured results from Phase 02, not on marketing.
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