Quantum-O · Chipset

A naturally quiet, fault-tolerant processor on one die.

Quantum-O v1.0 fuses SiV spin qubits in isotopically-purified ²⁸Si, non-Abelian Majorana boundary shielding, cryo-CMOS control, and Si₃N₄ photonic interconnects — every layer bonded into a single monolithic package.

T₂ coherence
2.4 s
uncorrected, ²⁸Si
Logical error
< 10⁻⁶
Majorana braided
Gate energy
< 0.5 µW
per cryo-CMOS gate
Interconnect
738 nm
Si₃N₄ micro-ring
Architecture

Four bonded layers. One monolithic die.

Reading the die top-down, from the cryogenic optical fabric through the topological shield to the ²⁸Si spin core.

LAYER 04
Photonic Waveguide Network (Si₃N₄)
738 nm micro-ring resonators bind SiV emission into flying photonic qubits and route entanglement across the die array.
LAYER 03
Cryo-CMOS Control (sub-Kelvin)
Integrated microwave pulse generators, readout amplifier arrays, DC bias — control line length drops from metres to micrometres.
LAYER 02
Topological Shielding — Majorana boundaries
Non-Abelian zero-mode tracking lines simulate anyon braiding, holding logical error rates below 10⁻⁶.
LAYER 01
Active Quantum Core (²⁸Si substrate)
Isotopically-purified silicon hosts SiV colour centres in deterministic diamond nanostructures. T₂ > 1.2 s.
Comparison

Why the monolithic path wins.

ModalityT₂InterconnectFault tolerance
Superconducting~100 µscoax bundlesexternal QEC
Trapped ion> 10 sfree-space opticsexternal QEC
Photonic (LOQC)n/awaveguidesprobabilistic
Quantum-O v1.02.4 son-die Si₃N₄Majorana braided
Live telemetry

Instrument panel — 32-node qubit matrix.

A simulated sub-Kelvin readout of the Quantum-O v1.0 core, sampled every 1.8 s.

● QPU ONLINEtier 1 · 0.0150 K · tier 2 · 4.0000 K
FIDELITY
99.92%
GATE
GDPE / CZ
NODE ACTIVE
--
System consoletail -f /var/log/qo.log
[00:00:00] SYSTEM BOOT — Quantum-O v1.0 cores online.
[00:00:01] Cryo-stack thermalised. Tier 1 substrate stable.
Statutory utility patent · US 2024/XXXXXXX A1

The patent series, one sheet at a time.

Nine sheets covering the monolithic dual-layer hybrid spin-topological QPU with integrated cryo-CMOS and Si₃N₄ photonic waveguide interconnects.

Sheet 1 · Title
Sheet 1 · TitlePCT/USPTO Formal Utility Patent Application — Quantum-O Chipset: A monolithic dual-layer hybrid spin-topological quantum processing apparatus. Inventor: Fabian Jean-Baptiste. Assignee: Quantum Operations LLC.
Technical whitepaper · June 2026

The whitepaper, chapter by chapter.

Five chapters — from the hybrid Hamiltonian to the Gaussian-derivative pulse envelope and the entangling CZ evolution.

§1 · Introduction

Eradicating dephasing and interconnect bottlenecks

Modern quantum information systems suffer from a physical limitation: the interconnect bottleneck. Superconducting systems rely on vast networks of coaxial cables that feed thermal noise directly into the processor envelope. Trapped-ion systems provide high coherence but remain restricted by macroscopic optical alignment tolerances and slow gate execution speeds.

The Quantum-O v1.0 chip circumvents these vectors entirely by implementing a globally exclusive, two-tier monolithic layout that combines hardware error-correction with optical signal routing on a single die.

Eradicating dephasing and interconnect bottlenecks
Whitepaper facsimile · page 1