Quantum-O · Chipset

A naturally quiet, fault-tolerant processor on one die.

Quantum computing has been held back by two physical constraints: decoherence destroys qubit states, and interconnect noise poisons gate operations. Quantum-O v1.0 eliminates both — SiV spin qubits in isotopically-purified ²⁸Si, non-Abelian Majorana boundary shielding, on-die Cryo-CMOS control, and Si₃N₄ photonic interconnects bonded into a single monolithic package.

Quantum-O v1.0 fully assembled processor stack

Live telemetry Patent series Whitepaper

T₂ coherence

2.4 s

uncorrected, ²⁸Si

Logical error

< 10⁻⁶

Majorana braided

Gate energy

< 0.5 µW

per cryo-CMOS gate

Interconnect

738 nm

Si₃N₄ micro-ring

Architecture

Four bonded layers. One monolithic die.

Reading the die top-down, from the cryogenic optical fabric through the topological shield to the ²⁸Si spin core.

Annotated cross-section of the Quantum-O v1.0 chipset — processor stack, qubit array, photonic layer, cryogenic driver, thermal interface — Fig. A · Annotated cross-section — Q-O v1.0 monolithic stack

Exploded view of the four bonded layers of the Quantum-O v1.0 chipset

LAYER 04

Photonic Waveguide Network (Si₃N₄)

738 nm micro-ring resonators bind SiV emission into flying photonic qubits and route entanglement across the die array.

LAYER 03

Cryo-CMOS Control (4 K)

Integrated microwave pulse generators, readout amplifiers and DC bias execute gates below 0.5 µW — line length drops from metres to micrometres, keeping thermal load off the sub-Kelvin core.

LAYER 02

Topological Shielding — Majorana boundaries

Non-Abelian zero-mode tracking lines simulate anyon braiding, holding logical error rates below 10⁻⁶.

LAYER 01

Active Quantum Core (15 mK, ²⁸Si substrate)

Isotopically-purified silicon (99.9999% ²⁸Si) hosts SiV colour centres in deterministic diamond nanostructures on a hexagonal lattice. Eliminating the ambient nuclear-spin bath pushes T₂ beyond 1.2 s.

Comparison

Why the monolithic path wins.

Modality	T₂	Interconnect	Fault tolerance
Superconducting	~100 µs	coax bundles	surface-code QEC
Trapped ion	> 10 s	free-space optics	surface-code QEC
Photonic (LOQC)	n/a (flying)	off-chip waveguides	probabilistic / KLM
Neutral atom	~1–10 s	optical tweezers	surface-code QEC
Quantum-O v1.0	2.4 s	on-die Si₃N₄ 738 nm	Majorana-braided (< 10⁻⁶)

Core innovations

Six breakthroughs. One monolith.

Every element of the Q-O v1.0 stack is a defensible engineering claim — the combination is what makes the architecture new.

INV-01

Spin-Topological Hybrid

First monolithic integration of spin-based and topological qubit architectures on a single die — combining the coherence of SiV colour centres with Majorana-mode fault tolerance.

INV-02

Majorana QEC Layer

Non-Abelian anyon braiding projects topological shielding boundaries around each spin-qubit cluster, delivering hardware-level error correction without full surface-code overhead.

INV-03

Photonic Interconnect

A Si₃N₄ waveguide network replaces metallic trace routing. Micro-ring resonators map spin states into flying photonic qubits at 738 nm, distributing entanglement without galvanic contacts.

INV-04

Integrated Cryo-CMOS

Control electronics built into the die at 4 K collapse microwave line lengths from metres to micrometres, eliminating the coaxial-cable bottleneck that limits every competing architecture.

INV-05

Pure-Optical CZ Gate

A photon-mediated controlled-phase gate targets 99.92% fidelity using Gaussian-derivative pulse shaping (GDPE) — no noisy microwave bus between qubit pairs.

INV-06

²⁸Si Isotopic Substrate

Isotopically-purified Silicon-28 (99.9999%) removes the ambient nuclear-spin bath — the dominant dephasing mechanism — extending uncorrected T₂ to 2.4 s.

Live telemetry

Instrument panel — 32-node qubit matrix.

A simulated sub-Kelvin readout of the Quantum-O v1.0 core, sampled every 1.8 s.

● QPU ONLINEtier 1 · 0.0150 K · tier 2 · 4.0000 K

FIDELITY

99.92%

GATE

GDPE / CZ

NODE ACTIVE

System consoletail -f /var/log/qo.log

[00:00:00] SYSTEM BOOT — Quantum-O v1.0 cores online.

[00:00:01] Cryo-stack thermalised. Tier 1 substrate stable.

Statutory utility patent · US 2024/XXXXXXX A1

The patent series, one sheet at a time.

Nine sheets covering the monolithic dual-layer hybrid spin-topological QPU with integrated cryo-CMOS and Si₃N₄ photonic waveguide interconnects.

Sheet 1 · Title, inventor & abstractPCT/USPTO formal utility patent application — Quantum-O Chipset: a monolithic dual-layer hybrid spin-topological QPU with integrated Cryo-CMOS control and on-chip Si₃N₄ photonic waveguide routing. Inventor: Fabian Jean-Baptiste. Assignee: Quantum Operations LLC.

Technical whitepaper · June 2026

The whitepaper, chapter by chapter.

Five chapters — from the hybrid Hamiltonian to the Gaussian-derivative pulse envelope and the entangling CZ evolution.

§1 · Introduction

Eradicating dephasing and interconnect bottlenecks

Modern quantum information systems suffer from a physical limitation: the interconnect bottleneck. Superconducting stacks rely on vast networks of coaxial cables that feed thermal noise directly into the processor envelope. Trapped-ion systems provide high coherence but remain restricted by macroscopic optical alignment tolerances and slow gate execution speeds.

The Quantum-O v1.0 chip circumvents these vectors entirely by implementing a globally exclusive, two-tier monolithic layout that combines hardware error-correction with optical signal routing on a single die. The fundamental computational layer leverages the phase coherence of localised electron spins in silicon-vacancy (SiV) diamond centres embedded inside an isotopically engineered ²⁸Si substrate.

Ĥ_hybrid = Σᵢ Ωᵢ Ŝ_z,i  +  Σ⟨i,j⟩ J_ij γᵢ γⱼ (Ŝ₊,ᵢ Ŝ₋,ⱼ + H.c.)

Where Ω_i is the localised Zeeman splitting of the i-th SiV spin qubit, and non-Abelian Majorana zero-modes γ_i, γ_j are projected onto the boundaries of each spin cluster.

Eradicating dephasing and interconnect bottlenecks — Whitepaper facsimile · page 1 / 4

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